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  COORSTEK - Substrates, laser drilled/scribed, Ceramic for armor, tubes, any ceramic solution  
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DYCONEX - leading source for the most advanced PCB micro-structuring and interconnect technologies
 
 
  EGIDE-XERAM -Metal packages for hermetic sealing, HTTC packing    
 
 
 
  PRINT & FIRE-Thick film manufacturing. Contact Emmtech  
    IJ RESEARCH - Custom packages including bonding, sealing, joining, coating of glass, ceramic polymer & metal industries    
 
 
    REINHARDT MICROTECH Thin film metalized and patterned thin film substrates, LTCC combined with thin film substrates    
 
 
    TECHNOGRAPH - PRINT & FIRE, RF Microwave, PCB, Thick film manufacturing and assembly    
 
 
     

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