Emmtech represents in Israel two of world's leading manufacturers in the field of wire bonding.

SPM (Semiconductor Packaging Materials) is a diverse, world class manufacturer of interconnect solutions for the microelectronics industry. SPM is a leading provider of quality fine gold, aluminum and alloyed wire for diverse wire bonding applications.

DeWeyl Tool provides one the finest quality bonding wedges available. DeWeyl's primary business is manufacturing wire bond wedges, die pickup tools, and custom high precision tooling for the Semiconductor, Aerospace, and Medical Industry.

SPM - Semiconductor Packaging Materials

SPM is a diverse, world class manufacturer of interconnect solutions for the microelectronics industry. SPM products are currently divided into several product groups: bonding wire and ribbon, precision metal stampings, custom alloyed strip and cladded materials, and a variety of packaging solutions including waffle pack and tape on reel solutions.
SPM's products are assembled, integrated, or bonded to assemblies and subassemblies serving the data and wireless communications, automotive electronics, medical electronics, power semiconductors, microwave and RF, Internet server and European "smart card" industries.

SPM is a leading provider of quality fine gold, aluminum and alloyed wire. This high purity wire is sold to a diverse customer and application usage base including hybrid, medical and automotive electronic packages. SPM's special proprietary wire alloys and doping recipes, combined with its extensive wire manufacturing capabilities in the US, Morocco and Malaysia, make SPM the preferred choice for our global customers.

Semiconductor Packaging Materials (SPM) wire is widely used in the manufacturing process of microelectronic devices as the electrical interconnect either between a chip and substrate or between two chips. All materials used by SPM described are of the highest quality, refined and alloyed by SPM to produce the properties demanded of finished wire and ribbon products.
SPM gold wire standards are unsurpassed in the industry. SPM has perfected the process of manufacturing wires in diameters as small as 0.0005" and wires where uniformity of elongation, tensile strength and diameter are of paramount importance. Semiconductor Packaging Materials' high-purity wire is vacuum processed from highly refined metals. SPM has a long-standing reputation for providing custom wire properties for specialized applications using automatic bonders.

DeWeyl
DeWeyl provides the finest quality bonding wedges in the world. Located in Petaluma, CA (Northern California), DeWeyl's primary business is manufacturing wire bond wedges, die pickup tools, and Custom high precision tooling for the Semiconductor, Aerospace, and Medical Industry. DeWeyl produces wedges made from ceramic, titanium, and tungsten carbide used in bonding Aluminum, Gold, Copper, and Platinum wires.
Deweyl is the largest OEM tool supplier in the industry. DeWeyl supports material development programs with Universities and OEM manufacturers. ISO9000 is the minimum Quality level and we are also Medical Industry Class IV (Heart pacemakers, defibrillators) qualified.

Values
DeWeyl is dedicated to offering exceptional Customer Service and Technical Support with your valuable inputs. By working closely with our Customers, together we can combine our talents and solve your demanding wire bonding requirements.